In order to implement the "Guiding Opinions on Promoting the Development of Energy Electronics Industry" jointly issued by six departments of the Ministry of Industry and Information Technology (MIIT) at the beginning of this year, and to accelerate the promotion of technological breakthroughs in various fields of energy electronics and the enhancement of product supply capacity, under the guidance of the Department of Electronic Information of the MIIT, the Industrial Development Promotion Centre of the MIIT, together with Xiamen local government, co-sponsored the First Energy Electronics Industry Innovation Competition.

On 26-27 December, the final round of the Key Information Technology Track and the award ceremony were held in Xiamen Hyatt Regency Hotel.

After the strict screening of the competition, "Semiconductor Packaging Equipment Localisation Project" of Opto-Intel Technologies Co., Ltd. successfully entered the final. Our project belongs to the Innovative Technology Group B of the Key Information Technology Track.

In recent years, the rapid development of China's energy electronics industry, showing the trend of energy consumption of electricity, low-carbon power production, information-based production and consumption, with the application of the requirements of the higher and higher, to achieve a decisive role in the development of the industry key information technology breakthroughs have become an urgent need.

Smart sensing technology is an important key technology in the field of energy electronics. It is a technology that uses sensors and communication technology to achieve environmental sensing, data acquisition, information transmission and intelligent decision-making, and its application can be said to be everywhere, intelligent transportation, smart grid, intelligent agriculture, advanced medical care, smart cars and even military defence field. To achieve breakthroughs and development of intelligent sensing technology, it also requires a variety of technical capabilities to escort.

Sensor manufacturing is a complex process, through the use of more advanced chip design, manufacturing and packaging technology, not only can significantly reduce the power consumption of the sensor to enhance its performance and efficiency, but also to protect the reliability and stability, to achieve a single product as well as the entire system of normal and sustainable operation. Therefore, semiconductor chip manufacturing technology is very important.

In this competition, Opto-Optintel representatives launched an all-round introduction of the company's semiconductor packaging equipment localisation project, including the project background, enterprise development, team and technology foundation, products and innovations application and marketing and other related contents.

The project of semiconductor packaging equipment localisation is based on Opto-intel team's long-term deep technical precipitation and in-depth understanding of semiconductor manufacturing technology, relying on its own solid production base, for the whole process of semiconductor packaging to establish a strong equipment capability and process capability, through continuous independent research and development and innovation, to achieve the localisation of the core equipment for semiconductor packaging to create a series of high-quality, high-performance semiconductor characteristics of advanced process equipment for packaging. Packaging advanced process equipment. Vacuum Microwave Plasma System, Vacuum Solder Reflow Oven, Inert Gas Glove Box and Parallel Seam Sealing System are able to realise real high reliability packaging, significantly improve the quality of packaging and achieve effective protection of the chip. Especially suitable for high-end chip devices and surface sensitive or complex structure of the chip to deal with.

It is learnt that a total of 182 entries were solicited for the key information technology track in this competition, and a total of 90 entries entered the final round, being divided into three groups, namely, innovative technology, innovative application and innovative development. After strict expert evaluation, 11 first prizes, 18 second prizes, 22 third prizes, and 31 newcomer prizes were awarded.

The project of Opto-intel were honoured to win the third prize in this competition! We have demonstrated a level of strength that is not inferior to that of first-class enterprises in the industry, reflecting great potential for development and conveying a firm determination for development.

At the award ceremony, Jin Lei, Director of Basic Division of Electronic Information Department of MIIT, delivered a speech. He gave a comprehensive explanation of the origin, development history and future trends of energy electronics, and expressed his blessings for the successful holding of the competition. He expressed appreciation to the organisers, the Industry Promotion and Development Centre of MIIT and the local government of Xiamen, and sent full recognition and encouragement to the project teams participating in this competition.

Through this competition, we once again "go out", so that more people know us, see our entrepreneurial vigour and excellent scientific and technological achievements. To be able to get awards and honours to do is an exciting event, we will be more and more courageous. Achievement of their own high-reliability semiconductor packaging equipment field leader, we have been on the road!