On 31st January, Opto-Intel Technologies Co., Ltd. held the unveiling ceremony of Chongqing Semiconductor Packaging and Testing Validation Public Service Platform and the launch of Opto-Intel's heavyweight new products.

It is understood that the Western Science City (Beibei Section) of Chongqing and the resident enterprise Opto-intel to build the "Chongqing Semiconductor Packaging Testing and Verification Public Service Platform" focuses on the advanced preparation technology and capabilities of intelligent sensing chips, especially for power semiconductors, high-end optoelectronic sensing chips, MEMS sensing chips, semiconductor lasers, packaging testing and other areas of technology autonomy and device industry. The platform aims to realise technology autonomy and device industrialisation, and to form a more complete supporting system for electronic components.

The platform relies on the innovation ability of Opto-intel, and provides a full set of technology and process development and validation in the field of semiconductor packaging based on the domestic semiconductor packaging equipment independently developed by Opto-intel. The first phase of construction services mainly include microwave plasma cleaning, contact angle experiment, vacuum reflow soldering, placement and other core packaging process testing and verification services. The second and third phase of construction will carry Mige Lab and Southwest University related testing technology and services on line simultaneously.

At present, the first phase of the project has been fully completed and will be put into use soon.

On the one hand, the platform will provide technical support for upstream and downstream enterprises to form a more complete electronic components supporting system, thereby reducing the cost of common inputs and accelerating the realisation of technological autonomy and device industrialisation in Chongqing. On the other hand, the platform will promote the optoelectronic information industry in Chongqing and Beibei District sensor advantage of the cluster industry to grow, help the development of Western Science City (Beibei Section) of Chongqing and gain, for the construction of local economic development in Chongqing to bring great value.

On the same day, two new high-performance equipment for the packaging of silicon carbide chips were officially released, respectively, silver patch sintering machine ND1800 and nano-silver pressure sintering machine NS3000.

According to reports, Opto-intel developed silver sintering bonder ND1800 will improve the packaging efficiency of SiC chips, improve product yields, while further reducing costs. Nano-silver pressure sintering with low-temperature sintering and high-temperature service characteristics, as well as higher thermal conductivity, higher electrical conductivity and lower modulus of elasticity, and pressureless sintering compared to the advantages are very significant.