Applications

The system is perfectly used for cleaning and surface activation prior to semiconductor packaging process such as die bonding, wire bonding, underfill, molding, etc., capable to effectively remove the surface contaminants of organics and oxides from the packaging materials, excellently enhancing the bonding strength and adhesion performance, thus significantly improving the process yield. With automatic substrates or lead frames loading and unloading assembly, the system is featured with fast cleaning cycle and high cleaning uniformity, particularly suitable for highly demanding production where very high performance of cleaning results is mandatory.

Features

Enhanced surface treatment for all products. 

Consistent high-uniformity cleaning for all position of products 

Multiple operation and display for all process steps 

Automatic 4 lanes transferring with loading/unloading (max 6 lanes)

Automatic quick conversion of lane width for product changeover

High throughput productivity (450 strips/h for 5 lanes)

Unique air cooling design in chamber bottom 

Touch screen IPC & PLC based control system 

Specifications