Technical advantages: Mainly used to achieve void-free and perfect solder joints between high-power chip/device and its substrate. Process capability includes vacuum, inert or reducing atmosphere and our unique plasma enhanced technology to optimize soldering quality.

Product overview：

Classic proven system design

Powered by formic acid assistance technology

PLC control system with Windows-based computer interface

Applications: Void free soldering for diode laser, optical communication device, high power chip packaging.

Features:

Rapid and precise temperature control

Formic acid process for low-T solder application

Automatic gas flow control with MFC

Custom direct-heated tooling fixture plate

Easy-to-use GUI

Options:

Vacuum pump

Additional gas lines

Various deoxidation modules

Overpressure process capability

Custom heating plate

Extra monitor T/Cs

Water chiller